STS-202 determines solderability of component leads and terminations prior to being joined in a soldering operation. Uses dip and look test method in conformance with IPC, ANSI and MIL standards, including J-STD-002, MIL-STD-883 Method 2003 and MIL-STD-202 Method 208. Uses comparative analysis technique. Can be used in receiving inspection or on a production floor, as well as in a testing laboratory. Is designed to automate physical testing process; uses high-precision motion control, touch screen programming, and PID temperature controls. Can also be used for manual component lead tinning for low-volume applications.
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