AKM600P warpage measurement system performs single shot warpage measurement of an entire Fan Out Wafer Level Processing (FOWLP) panel and individual die on panels up to 600 x 600 mm simultaneously. Provides z-resolution down to 1.25µm in under 2 sec. using patented Shadow Moiré technology. 

Conducts warpage measurements at room temperature, or up to 300°C if thermal profiles are needed.

Akrometrix LLC, akrometrix.com

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