Gap filler 1400SL thermal interface material is a two-part, silicone-based, liquid material with low viscosity for flowing in and around tight, uniquely shaped structures to fill small voids and provide thermal transfer. Thermal conductivity is 1.4W/m-K. Is soft when cured, permitting absorption of coefficient of thermal expansion (CTE) stresses and providing mechanical shock dampening. For applications such as high-power components such as FETs, industrial controllers with transient loads and automotive electronics like DC-DC converters for hybrid vehicles. Low VOC formulation. Cures at room temperature with no byproducts.

Henkel Adhesive Technologies, www.bergquistcompany.com

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