Versaflow 4/55 inline selective soldering system features motorized adjustable y-axis for fluxer- and solder module, y- and z-variability, full convection preheater and a 508 x 508mm usable process area for inline production.

Designed for soldering large and complex board assemblies. Additional flux-, preheat- and solder modules can be integrated. All modules run autonomously through their configured programs. Setup times and operator interventions not required. Optional ImageSoft augmented-reality tool allows, with a tablet PC, 3D-views of the complete system – without having to open system enclosure. “Bad-board-recognition” recognizes whether in a multiple-up board each board needs to be soldered. If individual boards are not populated, the system will recognize this and not process these boards. Preheat section comes with rpm-controlled full-convection upper heater modules. Parameter Y-variable adjusts distance of two solder bath / solder nozzles automatically to the distance of individual PCBs in the multiple-up assembly. Different multiple-ups with different offsets can be processed in mixed operation - without manual intervention into the solder module and the attendant downtime. Y-variable also available for fluxer module. Z-variable option serves to solder on one PCB with two different sized nozzles. With the new design, the solder bath not in operation can now be lowered to up to 60mm below the operating level, to permit soldering between very tall components using only one nozzle.

Kurtz Ersa, www.ersa.com

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