SB6NX58-M500SI solder paste is designed for high-stress environments such as automotive. Contains 6% indium to balance and optimize thermal stress and deformation characteristics. Is said to offer improved solder joint strength over SnAgBiIn paste, especially with AuNi plated components. Anti-shock resistance is five times greater than SB6N, at 150C x 500 hr. aging. Shear strength after T/C at -40/+125C equals that of OSP substrates. 

Koki Co., www.ko-ki.co.jp

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