KNS Delivers Hybrid 3 Chip Placer
Published: 04 May 2015
Hybrid 3 chip placer has a placement accuracy of less than 10µm, for wafer-level packaging, FOWLP, SiP, MCM, flip-chip, modules and embedded components. Places both die and passive components. Based on high-speed AX/iX product family.
Kulicke & Soffa, www.kns.com
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