Delomonopox VE 72768 dual-curing epoxy resin offers bonding accuracy and is resistant to substances like oil, transmission fluid, gasoline, methanol and printing ink. Designed with hardeners, it is used where bonded or encapsulated components are exposed to extreme temperatures and harsh chemicals. Permits defined glob top encapsulation in tight spaces on a printed circuit board. With light curing, glob top forms a skin and can “freeze” its shape; adhesive doesn’t flow away during heat-curing process. Curing is a two-stage process: Adhesive is light-fixed in up to 5 sec. to achieve a die shear strength of more than 1N on the FR4 PCB material; then it is briefly heat cured (for example, 30 min. at 150°C) to obtain its full strength of 50MPa on FR4. Is offered in two viscosities, one for bonding applications and another for encapsulation.  Operating temperature range is from -65°C to 180°C.

Delo, www.delo.de/en/

• Prev
• Next