EMS Introduces 618-116 EMI Shielding Conductive Adhesive
Published: 08 February 2016
EMS 618-116 low-temperature cure one-part conductive adhesive is designed to cure in 30 min, at 100°C or rapidly at elevated temperatures. Is said to form high-strength, high-reliability conductive interconnects. Is for circuits assembly applications.
Engineered Material Systems, www.emsadhesives.com
Press Releases
- Austin American Technology Reports Strong Growth in Mexico
- GEN3 Announces Exclusive UK Distribution Partnership with RAS for HATS2 Test System
- Yamaha Robotics Brings Inspection Innovations for Growing Markets to electronica 2024
- Zero Defects International to Exhibit at Silicon Valley Expo and Tech Forum