FX-940 Ultra 3D AOI incorporates 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height-sensitive devices.  Uses Advanced Fusion Lighting and inspection tools including angled cameras, full-color digital image processing and image and rule-based algorithms. Provides inspection with 12MP/5-axis 3D Nytvision technology; complete 2D and 3D inspection capabilities; one top-down and four side-viewing cameras; automatic programming tools in fewer than 30 min.; high defect coverage/low false failures, and SPC data collection and reporting.

Nordson YesTech, www.nordsonyestech.com

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