Automated die attach tilt metrology is a new feature for shadow moiré or DFP systems (AXPs). Allows users to measure tilt angle of the bottom substrate to a mounted die/component/daughter board. Is embedded into existing Studio software platform to allow customers to automatically measure both warpage metrology and die attach tilt metrology on a variety of substrates. Measurements can be conducted pre-reflow at various temperature profiles during reflow and during reflow cooldown to examine effects die placement and temperature have on mating angle. Complete measurement of warpage and die attach tilt takes less than 2 sec. per measurement point along the temperature profile.

Akrometrix, www.akrometrix.com  

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