Liqui-Form 3500 thermal interface material is a one-part thermally conductive liquid-formable gel. Is designed to provide a balance between dispensability, low component stress and reworkability. Delivers conductivity of 3.5 W/m-K. Viscosity is stable and maintained during storage, processing and within the application. Reportedly does not suffer from material migration over time. Has low volumetric expansion and stability in continuous use at temperatures as high as 200°C. Has low ionics.

Henkel Adhesive Technologies, www.henkel-adhesives.com/thermal  

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