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Flexbond hot bar bonding is for flex circuit applications. Incorporates up to 18 bond heads that are selectively active based on RFID designation of placements. Uses pulse heat technology, closed-loop temp control and programmable pressure settings. Combines with Fuzion for full-process integration, including flux transfer, high-accuracy placement and hot bar soldering.Flexbondweb

Universal Instruments, uic.com

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