Technomelt AS 8998 is designed to provide fast dispensability to mask keep-out zones for printed circuit board assemblies that will undergo coating or chemical deposition processes. Is slump-resistant and compatible with common automated dispensing systems. Is a silicone-free, halogen-free, RoHS-compliant material that reportedly has excellent green strength after dispensing and solidifies upon cooling with no thermal or UV curing required.  Compatible with numerous substrate surfaces, the hot melt material provides good adhesion during various coating processes; reportedly peels quickly, leaving defined edges and zero residue. Is compatible with thermal processes up to 100°C.

Henkel Adhesive Technologies, www.henkel-adhesives.com/electronics

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