Indium10.8HF halogen-free, no-clean solder paste provides non-wet open performance on large, high I/O electronic packages such as microprocessors.

Delivers an oxidation barrier to reduce head-in-pillow (HiP) defects and improve graping performance. Exhibits exceptional stencil printing, especially for small components (01005) and fast printing speeds (>125mm/sec.).

Indium, indium.com/indium10.8HF

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