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Pulsar solderability test system provides precise handling of electronic components for automated flux and solder dipping of component terminations according to requirements of J-STD-002 and other applicable standards for the “Dip and Look” method. Reportedly can tin virtually any component from axial resistors to QFPs and other leaded and leadless packages.

Hentec Industries (formerly RPS Automation), rpsautomation.com

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