Auto Slice & View 4.0 three-dimensional (3D) reconstruction software makes 3D imaging faster, easier, more accurate and cost-effective. Enables 3D structure and composition of samples at the nanometer scale. Works with all FEI DualBeam focused ion beam (FIB)/scanning electron microscope (SEM) platforms. Imaging can be combined with analytical capabilities, such as energy dispersive x-ray spectrometry (EDS) and electron backscatter diffraction (EBSD), to ensure no information is lost in sectioning of sample. Modifies automated procedures on-the-fly, with ability to add analytical signals if an unexpected feature is revealed. Imaging and analysis can be dynamically directed to selected areas of the section or applied only on certain slices to save time. Slice & View analyses can be performed at multiple sites to permit long, unattended runs over night or weekends. Advanced tiling and stitching capabilities maintain high spatial resolution over sections larger than a single field of view. New algorithms help to ensure uniform thickness of slices and precise and reproducible placement of each cut, for higher accuracy. Redesigned interface optimizes user guidance and ensures critical information is presented, if needed. Prompted workflow approach streamlines setup of automated procedures, and any procedure can be tagged as a template to serve as the basis for future analyses.

FEI, fei.com/software/auto-slice-and-view

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