EP3UF one-component epoxy contains thermally conductive fillers with small particle sizes. Thermal resistance of 5-7 x 10-6 K•m²/W. Can be applied in bond lines as thin as 10-15µm. Thermal conductivity 9-10 BTU•in/ft²•hr•°F and volume resistivity exceeds 1014ohm-cm. Passes NASA low outgassing tests. For bonding and underfills in microelectronics packaging/assembly applications. Unlimited working life at room temperature and fast cures at temperatures down to 250°F. Tensile strength 5,000-7,000 psi and compressive strength 18,000-20,000 psi. Bonds to metals, composites, ceramics, and many plastics. Has low shrinkage upon curing. Is serviceable over temperature range of -60° to +250°F.

Master Bond, www.masterbond.com

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