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SAN JOSE – Worldwide semiconductor manufacturing equipment billings reached $10.56 billion in the first quarter, up 7% sequentially, and down 2% year-over-year, according to SEMI.
 
The association also said worldwide semiconductor equipment bookings were $8.08 billion for the quarter, down 23% year-over-year, and down 11% sequentially.
 
“While bookings have weakened in the first quarter, overall industry billings remain at levels higher than the end of last year,” said Stanley T. Myers, president and CEO of SEMI. “Some regions, specifically North America, Korea and China, posted strong quarter-over-quarter growth in spite of the conservative capital environment.”
 
 
SALEM, OR – Electronics manufacturers pursuing individual or group recycling programs in compliance with Oregon's new electronics recycling law must submit plans by July 1.

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NEW YORK – Vietnam’s January 2007 entry into the World Trade Organization set in motion what’s become a fast-growing electronics manufacturing locale. The Southeast Asian nation’s low labor cost, availability of trainable local population and favorable government policies are attracting global EMS/ODM companies to set up operations, says research firm Frost & Sullivan.
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COLORADO SPRINGSPhoto Stencil has expanded its capacity in the US and abroad, adding an LPKF StencilLaser G 6080 at its Colorado Springs headquarters.
 
The company also upgraded its photoplotting infrastructure and added electroformed stencil manufacturing capacity and capability, and expanded its manufacturing facility in Penang, Malaysia.
 
 
INDIANAPOLIS – Private investment firm Berwind Corp. has acquired Specialty Coating Systems from Bunker Hill Capital L.P. for an undisclosed sum
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BRUSSELS – After eight years of study, the European Commission has cleared Tetrabromobisphenol A for use without restriction in the EU. This marks the end of an official risk assessment of TBBPA, a brominated flame retardant used in more than 70% of PCBs.

The EU Risk Assessment evaluated TBBPA for potential risks to human health and the environment. The commission concluded no risk was identified for the reactive use of TBBPA such as in epoxy resins used in printed circuit boards.

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