News
ELKHART, IN – EMS provider CTS Corp. announced the acquisition of privately held Orion Manufacturing Inc. for approximately $10 million in cash.
SIOUX FALLS, SD – Raven Industries reported fourth-quarter sales and earnings rose 14% and 3%, respectively, for the period ended Jan. 31.
CHARLOTTE, NC – The North Carolina Economic Investment Committee voted today to award a Job Development Investment Grant to Tessera Technologies.
The grant will support Tessera’s consumer optics plans, enabling the company to add 185 jobs and invest approximately $30 million in its Charlotte-based wafer-level optics facilities during the next five years, the company said in a press statement.
The grant calls for the state to provide funds equal to 65% of the state personal income withholding taxes derived from the creation of new jobs, provided Tessera meets set performance targets. Should the company create the jobs called for under the agreement and sustain them for nine years, the agreement could yield as much as $2.64 million in benefits.
The grant will support Tessera’s consumer optics plans, enabling the company to add 185 jobs and invest approximately $30 million in its Charlotte-based wafer-level optics facilities during the next five years, the company said in a press statement.
The grant calls for the state to provide funds equal to 65% of the state personal income withholding taxes derived from the creation of new jobs, provided Tessera meets set performance targets. Should the company create the jobs called for under the agreement and sustain them for nine years, the agreement could yield as much as $2.64 million in benefits.
EINDHOVEN, NETHERLANDS – Assembléon B.V. and Valor Computerized Systems have established a partnership under which Assembléon’s pick-and-place machine interfaces will be integrated into Valor’s software.
Enhanced machine interfaces are available for Valor’s vPlan on Assembléon’s A-Series, M-Series and X-Series machines. Now, vPlan provides an API to generate manufacturing process definitions for Assembléon machines.
Enhanced machine interfaces are available for Valor’s vPlan on Assembléon’s A-Series, M-Series and X-Series machines. Now, vPlan provides an API to generate manufacturing process definitions for Assembléon machines.
LOWELL, MA – Tyco Electronics today announced it intends to sell its Radio Frequency Components and Subsystem business.
The segment represented about $500 million of total the business unit’s $887 million in sales in 2007, but is considered a non-strategic business.
Headquartered in Lowell, MA, the unit employs about 2,000 people at 11 locations throughout the U.S. and Europe.
Tyco has no current plans to sell its Public Safety/Land Mobile Radio Systems and Products businesses, which are also part of the Tyco Electronics unit.
The segment represented about $500 million of total the business unit’s $887 million in sales in 2007, but is considered a non-strategic business.
Headquartered in Lowell, MA, the unit employs about 2,000 people at 11 locations throughout the U.S. and Europe.
Tyco has no current plans to sell its Public Safety/Land Mobile Radio Systems and Products businesses, which are also part of the Tyco Electronics unit.
SAN JOSE – The MicroElectronics Packaging and Test Engineering Council will hold its 6th Annual MEMS packaging symposium on May 22.
The one-day event will take place at the Wyndham Hotel in San Jose, and will explore new applications, market opportunities, and enabling technologies for MEMS, including emerging biomedical and consumer sectors.
The program will include talks on MEMS and the consumer, automotive and biomedicine markets, and on the impact of wafer-level packaging and 3-D ICs on foundries and the industry.
Fore more information, visit www.meptec.org.
The one-day event will take place at the Wyndham Hotel in San Jose, and will explore new applications, market opportunities, and enabling technologies for MEMS, including emerging biomedical and consumer sectors.
The program will include talks on MEMS and the consumer, automotive and biomedicine markets, and on the impact of wafer-level packaging and 3-D ICs on foundries and the industry.
Fore more information, visit www.meptec.org.
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