SAN JOSE – The MicroElectronics Packaging and Test Engineering Council will hold its 6th Annual MEMS packaging symposium on May 22.
The one-day event will take place at the Wyndham Hotel in San Jose, and will explore new applications, market opportunities, and enabling technologies for MEMS, including emerging biomedical and consumer sectors.
The program will include talks on MEMS and the consumer, automotive and biomedicine markets, and on the impact of wafer-level packaging and 3-D ICs on foundries and the industry.
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