ATLANTA – Beginning Sept. 14, CIRCUITS ASSEMBLY seeks participants for its annual Service Excellence Awards (SEAs) for EMS providers and electronics assembly equipment, material and software suppliers.

BANNOCKBURN, IL -- IPC today released the first industry-consensus guidelines on handling, packaging and storing printed wiring boards.

BERLIN – Dr. Ingeborg Hochmair, cofounder and CEO of MED-EL, will keynote the iNEMI workshop Challenges Facing Medical Electronics Packaging and Substrates. The event will take place here Sept. 16 and 17.

Dr. Hochmair will discuss the role played by cochlear implants and the challenges faced as these technologies are deployed globally.

E. Jan Vardaman, president and founder of TechSearch International, is slated as the dinner speaker on Sept. 17. She will discuss the future of medical electronics and the role packaging will play to help miniaturize medical devices for home and hospital applications.

The iNEMI workshop will explore the substrate, packaging and interconnect technology challenges and standardization gaps anticipated in the implantable and portable segments of the medical electronics industry. The goal is to identify the most critical needs, determine which needs are best solved through collaborative efforts, and then form action groups to initiate the required work.

The agenda also features speakers from Dyconex; Endicott Interconnect Technologies; IMEC; IZM; maris TechCon; Micro Systems Engineering; Philips Applied Technology; Reinhardt Microtech; Sanmina-SCI, and Valtronics.

To register, visit http://www.inemi.org/cms/calendar/Energy_WS_Oct2010.html.

MACAO -- Deswell Industries reported fiscal first-quarter net sales fell 5.9% to $9.7 million in the company's electronic and metallic segment.