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SIOUX FALLS, SD -- Raven Industries today announced record sales and earnings for its second quarter ended July 31 on growing demand in energy, precision agriculture and military surveillance.

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WASHINGTON -- Companies pared capital spending on durable goods last month, according to the latest US Commerce Department figures.

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GRAND CAYMAN ISLANDS -- Top 25 EMS company 3CEMS plans to go public in 2013, and has set a goal of $1 billion in revenues by that time.

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BANGKOKEllsworth Adhesives has launched Ellsworth Adhesives (Thailand) Ltd. here.

The company will provide local support to Thai customers with technical support, local stocking and more delivery options.

Staff here will focus on building accounts and managing customer service, developing sales and marketing initiatives, and providing financial and administrative management.

The firm distributes adhesives, sealants, lubricants, coatings, encapsulants, tapes, soldering products, surface preparations, specialty chemicals, maintenance and repair products and dispensing equipment.

EL SEGUNDO – Concerns are rising in the US and India over perceived security risks associated with using Chinese-made telecommunications equipment, potentially slowing global sales growth for China’s major gear makers, says iSuppli Corp.

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SANTA CLARA, CAMEPTEC will host a semiconductor packaging symposium on Nov. 10 here.

Speakers will take a look at trends and projections in packaging technology with an event covering technical roadmaps from throughout the industry, including IDMs and OEMs, as well as packaging houses and EMS providers. 

Mark Brillhart of Cisco will keynote with Technology Innovation in High Performance Networking Products. He will explore innovations in high-performance packaging that meet the challenges of high-speed electrical performance, signal and power integrity and enhanced thermal dissipation, and address the strenuous requirements of product-level reliability, high availability and long field life.

Technical sessions include Semiconductor Industry Roadmaps: Carving out the Decade Ahead; SATS Technology Development:  Merging Internal and Customer Roadmaps; System-Level Implications on IC Package Design, and Packaging Roadmaps for Emerging Applications.

For more information, visit http://www.meptec.org/meptecroadmaps20.html

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