Master Bond EP21TDCN-LO is an electrically conductive two-component adhesive/sealant effective for grounding, shielding and static dissipation applications. Is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. Passes ASTM E595 tests for NASA low outgassing. Features a nickel filler. Has a volume resistivity of 5-10 ohm-cm and a thermal conductivity of 11 BTU•in/ft²•hr•°F [1.59 W/(m·K)]. Bonds well to metals, composites, ceramics and many plastics. Has tensile lap shear, tensile and T-peel strength of 1,400-1,600 psi, 3,000-4,000 psi and 15-20 pli, respectively. Resists exposure fuels, oils, organic solvents and water. Optimum cure is overnight at room temperature, followed by two to three hours at 150-200°F. Is serviceable from -100°F to +275°F. Is available for use in ½ pint, pint, quart, gallon and 5 gallon container kits. Has a shelf life of six months at ambient temperatures in original, unopened containers.

Master Bond, www.masterbond.com

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