ThermoActive Suite Plus dynamic profile software is for rework process control. Is capable of self-adjusting thermal output to reach safe reflow temperatures automatically. In Auto Profile Mode, software responds by increasing or decreasing top heat relative to the environment, ramp rate and temperature limits. Has six general profiles; automatically adjusts wattage required to achieve high-yield small, medium and large PCB rework. Features precision targeting of visible focused IR. Doesn’t induce laminar hot air flow or heat migration issues with adjacent components. Eliminates touchup rework. Precisely measures and controls actual IC temperature. Senses and reacts to component temperature vs. heater core temperature. Displays solder sphere temperature, time above liquidus, and overlays multiple data points. Has component placement accuracy of 5µm. Incorporates parallax reduction 1" cube technology.

PDR Americas, pdr-rework.com

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