TF 1800 BGA/SMD rework system incorporates top-side inductive-convection heater, which provides rapid heat-up and active cooling of solder joints. Inductive-convection technology allows for an active cooling feature, which provides controlled component/PCB cool down directly through the nozzle. High-efficiency, low thermal mass design reportedly takes less power to operate and is more reliable than conventional heaters. Stepper motor drives automated reflow head. Has 28µm (0.0011”) placement accuracy. Vacuum pick/shaft design with optical sensor is counterweight balanced. Includes adjustable height bottom-side IR preheater. Other features include HD vision overlay system for optical alignment with quad-field imaging capability for placement of outsized BGAs or large fine-pitch QFPs and an integrated underside board support wand to prevent warping during reflow.

Pace Worldwide

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