640-35 (dam) and 640-46 (fill) dam and fill UV-cured chip encapsulants, for chip-on-board smart card applications, protect wire bonds and reduce stresses associated with thermal cycling. Cure rapidly when exposed to intense UV light centered at 365nm. Are for encapsulating small chips in smart card applications where fast processing is required. Reportedly withstand circuit board reliability test criteria.

Engineered Material Systems, conductives.com

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