535-11M-12 UV cured epoxy has been designed to pass rigorous reliability requirements. Eliminates warpage in electronic assemblies and can be used in other bonding applications in fiber optics and camera modules. Can be used for lens bonding, chip encapsulation in smart cards and general bonding applications in photonics assembly. Cures rapidly when exposed to high-intensity UV light. Is a low outgassing, flexible, high-strength epoxy adhesive that does not contain antimony. Is a screen printable version of 535-11M-7 UV cure adhesive.

Engineered Material Systems, www.emsadhesives.com

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