Speedmask 9-20479-B-Rev-A UV/light cure temporary masking agent protects connectors and other components during soldering or conformal coating.

Features tight viscosity tolerance which aids in maintaining process control during application. Cures in seconds under UV/visible light and is solvent- and silicone-free. It is benign to gold or copper finishes on connector pins or other components. Thixotropic material flows consistently with all forms of manual, semiautomatic or fully automated dispensing and forms stable coating prior to fast light cure. Removable by peeling, leaving behind no ionic or silicone contamination.

Dymax, www.dymax.com

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