vVision and SI software use 3D solder joint measurement.

Viscom XMplus camera module reportedly produces easy-to-classify height and position values. Several height profiles are measured at the solder meniscus with a resolution of 10µm. Angled cameras ensure panorama view of components and their solder joints from eight directions. Measured profiles of a solder joint are evaluated using a mathematical procedure.

Viscom
www.viscom.com

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