Sarcon SPG-20A silicone is an easy-to-dispense, low-viscosity compound that exhibits a thermal conductivity of 2.0W/m°K and a thermal resistance of 2.1°K•cm²/W.

When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely fills unwanted gaps as small as 0.08mm. Permits more efficient transfer and dissipation of heat from component and improved performance. Is an alternative to thermal grease. Form-in-place silicone material requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a temperature range of -40C to +150C.

Fujipoly America

fujipoly.com

Register now for PCB West, the Silicon Valley's largest PCB industry trade show: pcbwest.com! Now with full-day electronics assembly tutorials!

• Prev
• Next