Master Bond EP3HTSDA-1 is a single-part, no-mix epoxy adhesive designed for die attach applications.

Exhibits die shear strength of 20-22kg-f and has a thermal conductivity of over 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. Reportedly has unlimited working life at room temperature and will cure in 20 to 30 minutes at 250°F or 5 to 10 minutes at 300°F. Is NASA low outgassing approved. Has a Shore D hardness of 75-85 and is engineered to withstand thermal cycling and shock. Adheres well to metals, ceramics, and silicon dies. Service operating temperature range is from -80°F to +400°F. Contains silver fillers and has a volume resistivity of <0.001ohm-cm. Retains conductivity upon aging and provides excellent moisture and chemical resistance.

Master Bond
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