Solder Fortification preforms are generally rectangle- or disk-shaped pieces of alloyed metal that do not contain any flux.

Will reflow at the same temperature as the solder paste, with the solder paste providing the necessary flux. Increases volume of solder above what could be achieved with just solder paste, especially for stencils with a pitch of 0.3mm or less. Show improved drop test results, fewer issues with flux residue, reduced rework, improved fillet shape and volume. Can be added to a deposit of solder paste using standard pick-and-place equipment.

Indium

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