Indium Debuts Indium11.8HF-SPR Solder Paste
Published: 07 February 2018
Indium11.8HF-SPR solder paste can be reflowed in air and nitrogen.
No-clean, Pb-free Type 5 solder meets fine-feature printing requirements of mobile manufacturers. Offers stencil print transfer efficiency through small apertures (≤0.66 area ratio) on a range of processes. Is halogen-free per IEC 61249-2-21 test method EN14582. Stencil life >12 hr. Is said to eliminate hot and cold slump to inhibit bridging and solder beading defects. Avoids potential for HiP and graping defects with a unique oxidation barrier.
Indium
Press Releases
- Koh Young Honored by Foxconn with 2024 Digital Ecosystem Partner Award
- SIA Applauds Finalization of CHIPS Investments for Intel Manufacturing Projects
- Spectrum Advanced Manufacturing Technologies Named Manufacturing Partner for D-Orbit USA
- Absolute EMS Enters Strategic Partnership with PTEC Solutions to Enhance End-to-End Electronics Manufacturing Capabilities