EMS Debuts DA-6010 Die Attach Adhesive
Published: 12 March 2018
DA-6010 nonconductive die attach adhesive for image sensors and circuit assembly (chip on board) applications has a moderate glass transition temperature (Tg) and modulus.
With an optimized rheology for needle dispensing by time-pressure, auger or positive displacement, is designed to adhere to both flexible and rigid substrates.
Engineered Material Systems
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