Solder paste analysis toolkit integrates market requirements and offers turnkey solder evaluation tool.

PCB design, bill of materials, full programming documentation, setup, test methods, and step-by-step directions for a designed experiment are incorporated. Integrates area arrays down to 0.3mm pitch, 0.4mm pitch BTCs and discretes from 1206s down to 008004s. Unpopulated side of the board offers a design to evaluate slump, spread, solder balling, SIR and print to fail. Balances 22 material properties to be tested, along with BOM and labor costs. A user-defined scorecard that prioritizes various solder paste characteristics and weightings summarizes rating information to indicate the best solder paste for a specific operation.

Henkel
henkel-northamerica.com

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