Master Bond EP3HTSDA-2 silver-filled epoxy adhesive is a one-component system. Is not premixed or frozen, and has an “unlimited” working life at room temperature.

Possesses a high thermal conductivity of 45-49 BTU•in/ft²•hr•°F [6.5-7.0 W/(m•K)]. Can be applied in ultra thin bond lines and contains particles with an average size of 2-3 µm. Exhibits thermal resistance of 2-3 x 10 -6 K•m²/W. Electrical conductivity (volume resistivity) less than 0.001 ohm-cm. Meets NASA low outgassing specifications and is serviceable from -80° to +450°F (-62° to +232°C). Adheres to similar/dissimilar substrates such as aluminum, ceramic, copper, fiberglass, polyimide and silicone die. Cures in 20-30 min. at 250°F or 5 to 10 min. at 300°F. Die shear strength has a 20-20 Kg-f value at 75°F measured for a die size of 2x2mm. Comes in syringes or glass jars. Common sizes range from 20g, 50g, 100g to one and multiple pound units. Simple refrigeration recommended. Shelf life is a min. of 3 months in original unopened syringes or jars.

Master Bond

masterbond.com/properties/thermally-conductive-epoxy-adhesives

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