Sarcon 30XR-m is a high-performance thermal interface material that exhibits low thermal resistance.

Is 0.3mm thick. Available in dimensional sheets up to 200mm × 150mm or can be die-cut to fit application shape. When placed between a heat source such as a semiconductor and a nearby heat sink, it provides thermal conductivity of 17.0 W/m•K and thermal resistance of 0.30°C•in²/W. Silicone-based material fills air gaps between uneven components, board protrusions and recessed areas.

Fujipoly America 
fujipoly.com

Register now for PCB WEST, the largest trade show for the printed circuit and electronics industry in the Silicon Valley! Coming Sept. 11-13 to the Santa Clara Convention Center.

• Prev
• Next