PF606-PW215 water-soluble solder paste provides high-speed printability that reportedly produces great solder paste print quality, as well as a wide reflow process window for excellent solderability.

Has a long shelf and stencil life and excellent wetting and clean-ability. Benefits include anti-slump properties remain 6 to 12 hr. after print time; substantial deposition remains 12 hr. after printing; tack force remains at >130gf after 24-hr. stand; paste activity remains after 19-hr. stand, and no flux residue after cleaning.

Shenmao
shenmao.com


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