AccuFlux BTC-578 solder preforms enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTC).

Enable precision-controlled micro-flux coating of solder preform to promote repeatable wetting, spread and voiding for large area solder attach applications. Result in consistent void reduction and maximizes mechanical integrity of solder joint. Come in tape-and-reel packaging, and in all SAC, Innolot and low-temp SnBi alloys.

Alpha Assembly Solutions

alphaassembly.com

• Prev
• Next