Loctite Eccobond UF 1173 protective underfill material doesn’t contain any reportable REACH SVHCs, is not CMR classified and reportedly performs under high operating temperature environments.

Prioritizes health and safety. Is a one-component underfill that can be jet- or needle-dispensed, flows fast in and around tight interspaces and cures quickly to form void-free interconnect protection from shock, drop and vibration. Exhibits glass transition (Tg) temperature capability of 155°C and low coefficient of thermal expansion. Protects devices from stress-related failures. Copes with operating temperatures as high as 155°C.

Henkel
henkel-northamerica.com

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