Alpha OM-355 ultra-low voiding solder paste is designed for vacuum solder reflow.

Is said to provide excellent random solder ball and spatter performance. Minimizes solder bridging. Zero-halogen. Activator system optimized for  vacuum soldering to control rate of volatilization and reduction in surface tension, which permits voids to escape under reducing atmosphere. Voiding below 5%, without post-reflow defects commonly associated with vacuum soldering.

Alpha Assembly

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