Berquist Gap Pad TGP 6000ULM and 7000ULM thermal interface materials have been formulated with resin platform to deliver ultra-low modulus capabilities and thermal conductivity of 6.0W/m-K and 7.0W/m-K, respectively.

Customized, soft pads have high conformability to rough or irregular surfaces, filling intricate gaps and allowing for wet-out at interface. Provide low assembly stress alongside high thermal control. Reportedly ideal for telecom and datacom applications, such as high-end routers, switches, servers and base band units. Are tacky on both sides. 6000ULM integrates fiberglass support with one side offering minimal tack. 7000ULM is supplied without fiberglass support and similar tackiness levels on both sides of pad. Available in custom-cut shapes and sizes with top- and bottom-side protective liners.

Henkel
henkel-northamerica.com

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