DOWSIL EG-4000, EG-4100 and EG-4120 thermally stable silicone pottants encapsulate sensitive components within SiC and GaN power modules, on printed circuit boards and in industrial sensors and actuators.

Exhibited no cracking or delamination after accelerated aging at 215°C for 3,000 hr. in an air oven. Dielectric strength and mechanical properties remained stable throughout testing. Are two-part, low-viscosity formulations that enable good wetting, and cure within 60 min. at 150°C. After cure, they deliver dielectric insulation for dies and interconnects within power modules and protect them from the effects of moisture and other environmental contaminants. Also provide stress release from thermal and mechanical stresses. Firmness after cure ranges from hardness of 70g to 380g. Operating temperatures of EG-4100 and EG-4120 range from -40° to +215°C.

Dow Performance Silicones

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