FlexTRAK-SHS automated plasma treatment system includes 9.6-l (585 in³) large-volume F3-S process chamber that can be configured for larger strips or can treat more strips per cycle, yielding higher throughput and increased productivity for semiconductor and electronics packaging.

Advanced automation enables high-throughput processing of lead frames, high-density substrates, and other strip-type electronic components. Handles simultaneous strip buffering and plasma processing for higher chamber utilization. Advanced process controls, interchangeable electrode configurations, and plasma modes for flexibility. Plasma chamber employs same architecture and technology as smaller FlexTRAK platforms. Performs surface cleaning, oxidation removal, organic contamination removal, and surface activation. Is CE marked and meets SEMI S2/S8 (EH&S/Ergonomics) standards. Applications include pre-wire bond plasma treatment on semiconductor package substrates and lead frames; pre-underfill plasma treatment on flip-chip packages; pre-mold plasma treatment on semiconductor package substrates and lead frames; plasma treatment of semiconductor package substrates and lead frames for improved adhesion; removal/reduction of oxidation on lead frames.

Nordson March

nordsonmarch.com

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