2Di-LU1 inline bottom-side AOI system captures entire image of 460 x 500mm PCBA and carriers of 610 x 610mm in one pass in real time.

Stores image into memory and creates inspection data for entire board. Automates bottom-side inspection process, eliminates board flipping and handling, and ensures quality after potting, dip, wave, and selective soldering processes. Software includes Fujiyama algorithm, which provides through-hole joint inspection. Inspects for copper exposure, pin detection, pin-holes, solder fillet abnormalities, missing components, soldering problems, and bridges. Supports L-size PCBs, high clearances, heavy substrates, and mounted jigs.

Saki Corp.
sakicorp.com

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