Master Bond Supreme 3CCM-85 is a single-component epoxy designed for glob top and chip coating applications.

Can be used for encapsulation and bonding. Cures within 2-3 hr. at 175-185°F. Bonds well to similar and dissimilar substrates. Has high-volume resistivity of more than 10¹⁴ohm-cm and thermal conductivity of 5-10 BTU•in/ft²•hr•°F [0.72-1.44 W/(m•K)]. Is serviceable from -100°F to +350°F. Has long open time at room temp. Has thixotropic paste-like consistency and is easy to apply manually or with automated dispenser.

Master Bond
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