NC 256 no-clean flux has excellent soldering wetting.

Designed for wafer-ball bumping and other ball bumping, such as CSP, BGA, flip chip and package on package. During reflow, there is reportedly no contamination on solder ball or neighboring component. Can be screen or stencil printed or dispensed onto pads of component footprint or dipped onto solder ball of components. Can eliminate cleaning process and is compatible with underfill. Can be used for mass reflow or rework process.

Yincae Advanced Materials
yincae.com

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