GF400 is a two-part, liquid silicone-based gap filler that can be cured at room temperature or with heat.
Following cure, forms a low modulus elastomer said to prevent "pump-out phenomenon," for minimal degradation of effective heat dissipation. Can be used in a multitude of applications, from printed circuit board assembly and housing electronic components discretely to automotive electronics, including HEV and NEV batteries, power electronics, LEDs and fiber optic telecom equipment. Is soft and compliant, for low-stress applications, and provides an operating temperature range of -50° to +200°C. Low viscosity, enabling easier dispensing, and provides thermal conductivity of 4.0 W/m.K. Mix ratio is 1:1. Cure time is 20 min. at 100°C. Can also be cured at 25°C for 12 hr. or 90 min. at 60°C. UL94 V-O approved. Dielectric strength is 9 kV/mm.
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