Master Bond EP29LPTCHT is a two-component, low-viscosity epoxy compound that can be used for underfill and encapsulation applications.
Does not need excessive heat for curing and has long working life at room temp. Is electrically insulative and thermally conductive with fine particle size filler material. Can be dispensed into tiny gaps; when used as adhesive, it forms thin bond lines from 5 to 15µm, resulting in a thermal resistance of 12-15 x 10-6 K•m2/W. Features excellent flow properties with initial mixed viscosity of 5,000-15,000cps. Has thermal conductivity of 9-10 BTU•in/(ft2•hr•°F) and volume resistivity of more than 1015 ohm-cm, both measured at 75°F. Recommended cure schedule is overnight at room temp., followed by 4-5 hr. at 160°-180°F. After curing, it features coefficient of thermal expansion of 22-24 x 10-6 in/in/°C, along with compressive strength of 24,000-26,000psi and hardness of 80-90 Shore D.