Monopox TC2270 is a thermally conductive adhesive for chip bonding and other applications where electrically insulated heat transfer is required.
With a thermal conductivity of 1.7 W/mK, it reportedly ensures efficient heat transfer between die and packaging. Is supplied in 10ml syringes. Min. curing temperature is 60°C in about 90 min.; can be used with temperature-sensitive materials. Is a one-part adhesive; no mixing is required. Storage is at -18°C. Once cured, it delivers die shear strength of 60N/mm2 and has an end-application use range of -40 to +150°C. Has water absorption figure of 0.1%. Once cured, volume resistivity is greater than 1 x E14 Ohm cm; surface resistance is greater than 1 x E13 Ohms.